PCB Capacity
PCB General Capability |
Number of Layer |
1 – 20 Layer |
Maximum Processing Area |
680 × 1000MM |
Min Board Thickness |
2 Layer – 0.3MM ( 12 mil ) |
4 Layer – 0.4MM ( 16 mil ) |
6 Layer – 0.8MM ( 32 mil ) |
8 Layer – 1.0MM ( 40 mil) |
10 Layer – 1.1MM ( 44 mil ) |
12 Layer – 1.3MM ( 52 mil ) |
14 Layer – 1.5MM ( 59 mil ) |
16 Layer – 1.6MM ( 63 mil ) |
18 Layer – 1.8MM ( 71 mil ) |
Finished Board Thickness Tolerance |
Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% |
Twisting and Bending |
≤ 0.75%, Min: 0.5% |
Range of TG |
130 – 215 ℃ |
Impedance Tolerance |
± 10%, Min: ± 5% |
Hi-Pot Test |
Max: 4000V/10MA/60S |
Surface Treatment |
HASL, With Lead, HASL Free Lead |
Flash Gold, Immersion Gold |
Immersion Silver, Immersion Tin |
Gold Finger, OSP |
PCB Cu Thickness + Plating |
Out Layer Cu Thickness |
1 – 6OZ |
Inner Layer Cu Thickness |
0.5 – 4OZ |
Cu Thickness of PTH |
20UM ≤ Average ≤ 25UM |
Min: 18UM |
HASL with Lead |
Tin 63% Lead 37% |
HASL Free Lead |
7UM ≤ Surface Thickness ≤ 12UM |
Thick Gold Plating |
Ni Thickness: 3 – 5UM ( 120u” – 200u” ) |
Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” ) |
Immersion Gold |
Ni Thckness: 3 – 5UM ( 120u” – 200u” ) |
Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” ) |
Immersion Silver |
Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” ) |
Gold Finger |
Ni Thickness: 3 – 5UM ( 120u” – 160u” ) |
Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” ) |
U940 PCB Pattern Limit Capability |
|
Min Width |
0.075MM ( 3 mil ) |
Min Trace |
0.075MM ( 3 mil ) |
Min Width of Ring ( Inner Layer ) |
0.15MM ( 6 mil ) |
Min Width of Ring ( Out Layer ) |
0.1MM ( 4 mil ) |
Min Solder Bridge |
0.1MM ( 4 mil ) |
Min Height of Legend |
0.7MM ( 28 mil ) |
Min Width of Legend |
0.15MM ( 6 mil ) |
PCB Holes Processing Capability |
Final Hole Size |
Min: Laser 0.1MM, Machine 0.2MM |
Drilling Hole Size |
0.10 – 6.5MM |
Drilling Tolerance |
NPTH: ±0.05MM, PTH: ±0.075MM |
Final Hole Size Tolerance ( PTH ) |
φ0.20 – 1.60MM ± 0.075MM |
φ1.60 – 6.30MM ± 0.10MM |
Final Hole Size Tolerance ( NPTH ) |
φ0.20 – 1.60MM ± 0.05MM |
φ1.60 – 6.50MM ± 0.05MM |
Drilling Strip Hole |
-0L ~tu.’gth /width 2:1 |
Min Strip Hole Width 0.65MM |
Length & Width Tolerance ± 0.05MM |
Board Thickness / Hole Size |
≤ 10:1 |
PCB Cover Thickness Capability |
Solder Mask Color |
Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White |
Solder Mask Thickness |
Surface Line ≥ 10UM |
Surface Line Corner ≥ 6UM |
Surface Board 10 – 25UM |
Solder Mask Bridge Width |
Legend Color |
White,Yellow,Black |
Min Height of Legend |
0.70MM ( 28 mil ) |
Min Width of Legend |
0.15MM ( 6 mil ) |
Blue Gel Thickness |
0.2 – 1.5MM |
Blue Gel Tolerance |
±0.15MM |
Carbon Print Thickness |
5 – 25UM |
Carbon Print Min Space |
0.25MM |
Carbon Print Impedance |
200Ω |
Blind/Burried/Half Via PCB Capability |
|
Parameters |
(1+1)e.g.(4-layer)blind via:1-2,2-4(6-layer)buried via:2-3,3-4
(8-layer)blind/buried:1-3,4-5,6-8
|
Min Via |
Laser 0.1MM, Machine 0.2MM |
Half Via |
Min: 0.6MM |
Impedance Capability |
Resistance Value |
Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω |
PCBA Capability
Our PCBA Capability
SMT, PTH, mixed technology
SMT: 2,000,000 solder joints per day
DIP: 300,000 joints per day
Ultra fine pitch, QFP, BGA, μBGA, CBGA
Advanced SMT assembly
Automated insertion of PTH (axial, radial, dip)
Cleanable, aqueous and lead-free processing
RF manufacturing expertise
Peripheral process capabilities
Pressfit back planes & mid planes
Device programming
Automated conformal coating
For E-Test
Universal Tester
Flying Probe Open/Short Tester
High power Microscope
Solder ability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit With Polisher
If you need PCB assembly service as well, could you give us following information? |
1. |
Gerber file of the bare PCB board |
2. |
BOM(Bill of material) for assembly |
To short the Lead time, please kindly advise us if there is any acceptable components substitution. |
3. |
Testing Guide & Test Fixtures, if necessary |
4. |
Programming files & Programming tool, is necessary |
5. |
Schematic, if necessary |
Our Production Capability for PCB
Number of Layer |
1 – 20 Layer |
Maximum Processing Area |
680 × 1000MM |
Min Board Thickness |
2 Layer – 0.3MM ( 12 mil ) |
4 Layer – 0.4MM ( 16 mil ) |
6 Layer – 0.8MM ( 32 mil ) |
8 Layer – 1.0MM ( 40 mil) |
10 Layer – 1.1MM ( 44 mil ) |
12 Layer – 1.3MM ( 52 mil ) |
14 Layer – 1.5MM ( 59 mil ) |
16 Layer – 1.6MM ( 63 mil ) |
18 Layer – 1.8MM ( 71 mil ) |
Finished Board Thickness Tolerance |
Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% |
Twisting and Bending |
≤ 0.75%, Min: 0.5% |
Range of TG |
130 – 215 ℃ |
Impedance Tolerance |
± 10%, Min: ± 5% |
Hi-Pot Test |
Max: 4000V/10MA/60S |
Surface Treatment |
HASL, With Lead, HASL Free Lead |
Flash Gold, Immersion Gold |
Immersion Silver, Immersion Tin |
Gold Finger, OSP |
We provide OEM services to all sorts of printed circuit board assembly as well as electronic encased products.
Multilayer PCB Promotion In June
– 12% discount for multilayer PCBs
– more surprises for regular customers
Deadline: July 5th,2015
Advantages
– No MOQ
– OEM services provided
– Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable
– Factory direct price
– Replying with price in one working day
– Shipping within 24 hours
– Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free
PCB Capacity
PCB General Capability |
Number of Layer |
1 – 20 Layer |
Maximum Processing Area |
680 × 1000MM |
Min Board Thickness |
2 Layer – 0.3MM ( 12 mil ) |
4 Layer – 0.4MM ( 16 mil ) |
6 Layer – 0.8MM ( 32 mil ) |
8 Layer – 1.0MM ( 40 mil) |
10 Layer – 1.1MM ( 44 mil ) |
12 Layer – 1.3MM ( 52 mil ) |
14 Layer – 1.5MM ( 59 mil ) |
16 Layer – 1.6MM ( 63 mil ) |
18 Layer – 1.8MM ( 71 mil ) |
Finished Board Thickness Tolerance |
Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% |
Twisting and Bending |
≤ 0.75%, Min: 0.5% |
Range of TG |
130 – 215 ℃ |
Impedance Tolerance |
± 10%, Min: ± 5% |
Hi-Pot Test |
Max: 4000V/10MA/60S |
Surface Treatment |
HASL, With Lead, HASL Free Lead |
Flash Gold, Immersion Gold |
Immersion Silver, Immersion Tin |
Gold Finger, OSP |
PCB Cu Thickness + Plating |
Out Layer Cu Thickness |
1 – 6OZ |
Inner Layer Cu Thickness |
0.5 – 4OZ |
Cu Thickness of PTH |
20UM ≤ Average ≤ 25UM |
Min: 18UM |
HASL with Lead |
Tin 63% Lead 37% |
HASL Free Lead |
7UM ≤ Surface Thickness ≤ 12UM |
Thick Gold Plating |
Ni Thickness: 3 – 5UM ( 120u” – 200u” ) |
Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” ) |
Immersion Gold |
Ni Thckness: 3 – 5UM ( 120u” – 200u” ) |
Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” ) |
Immersion Silver |
Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” ) |
Gold Finger |
Ni Thickness: 3 – 5UM ( 120u” – 160u” ) |
Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” ) |
U940 PCB Pattern Limit Capability |
|
Min Width |
0.075MM ( 3 mil ) |
Min Trace |
0.075MM ( 3 mil ) |
Min Width of Ring ( Inner Layer ) |
0.15MM ( 6 mil ) |
Min Width of Ring ( Out Layer ) |
0.1MM ( 4 mil ) |
Min Solder Bridge |
0.1MM ( 4 mil ) |
Min Height of Legend |
0.7MM ( 28 mil ) |
Min Width of Legend |
0.15MM ( 6 mil ) |
PCB Holes Processing Capability |
Final Hole Size |
Min: Laser 0.1MM, Machine 0.2MM |
Drilling Hole Size |
0.10 – 6.5MM |
Drilling Tolerance |
NPTH: ±0.05MM, PTH: ±0.075MM |
Final Hole Size Tolerance ( PTH ) |
φ0.20 – 1.60MM ± 0.075MM |
φ1.60 – 6.30MM ± 0.10MM |
Final Hole Size Tolerance ( NPTH ) |
φ0.20 – 1.60MM ± 0.05MM |
φ1.60 – 6.50MM ± 0.05MM |
Drilling Strip Hole |
-0L ~tu.’gth /width 2:1 |
Min Strip Hole Width 0.65MM |
Length & Width Tolerance ± 0.05MM |
Board Thickness / Hole Size |
≤ 10:1 |
PCB Cover Thickness Capability |
Solder Mask Color |
Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White |
Solder Mask Thickness |
Surface Line ≥ 10UM |
Surface Line Corner ≥ 6UM |
Surface Board 10 – 25UM |
Solder Mask Bridge Width |
Legend Color |
White,Yellow,Black |
Min Height of Legend |
0.70MM ( 28 mil ) |
Min Width of Legend |
0.15MM ( 6 mil ) |
Blue Gel Thickness |
0.2 – 1.5MM |
Blue Gel Tolerance |
±0.15MM |
Carbon Print Thickness |
5 – 25UM |
Carbon Print Min Space |
0.25MM |
Carbon Print Impedance |
200Ω |
Blind/Burried/Half Via PCB Capability |
|
Parameters |
(1+1)e.g.(4-layer)blind via:1-2,2-4(6-layer)buried via:2-3,3-4
(8-layer)blind/buried:1-3,4-5,6-8
|
Min Via |
Laser 0.1MM, Machine 0.2MM |
Half Via |
Min: 0.6MM |
Impedance Capability |
Resistance Value |
Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω |
PCBA Capability
Our PCBA Capability
SMT, PTH, mixed technology
SMT: 2,000,000 solder joints per day
DIP: 300,000 joints per day
Ultra fine pitch, QFP, BGA, μBGA, CBGA
Advanced SMT assembly
Automated insertion of PTH (axial, radial, dip)
Cleanable, aqueous and lead-free processing
RF manufacturing expertise
Peripheral process capabilities
Pressfit back planes & mid planes
Device programming
Automated conformal coating
For E-Test
Universal Tester
Flying Probe Open/Short Tester
High power Microscope
Solder ability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit With Polisher
If you need PCB assembly service as well, could you give us following information? |
1. |
Gerber file of the bare PCB board |
2. |
BOM(Bill of material) for assembly |
To short the Lead time, please kindly advise us if there is any acceptable components substitution. |
3. |
Testing Guide & Test Fixtures, if necessary |
4. |
Programming files & Programming tool, is necessary |
5. |
Schematic, if necessary |
Our Production Capability for PCB
Number of Layer |
1 – 20 Layer |
Maximum Processing Area |
680 × 1000MM |
Min Board Thickness |
2 Layer – 0.3MM ( 12 mil ) |
4 Layer – 0.4MM ( 16 mil ) |
6 Layer – 0.8MM ( 32 mil ) |
8 Layer – 1.0MM ( 40 mil) |
10 Layer – 1.1MM ( 44 mil ) |
12 Layer – 1.3MM ( 52 mil ) |
14 Layer – 1.5MM ( 59 mil ) |
16 Layer – 1.6MM ( 63 mil ) |
18 Layer – 1.8MM ( 71 mil ) |
Finished Board Thickness Tolerance |
Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% |
Twisting and Bending |
≤ 0.75%, Min: 0.5% |
Range of TG |
130 – 215 ℃ |
Impedance Tolerance |
± 10%, Min: ± 5% |
Hi-Pot Test |
Max: 4000V/10MA/60S |
Surface Treatment |
HASL, With Lead, HASL Free Lead |
Flash Gold, Immersion Gold |
Immersion Silver, Immersion Tin |
Gold Finger, OSP |
We provide OEM services to all sorts of printed circuit board assembly as well as electronic encased products.