PCB Capacity PCB General Capability Number of Layer 1 – 20 Layer Maximum Processing Area 680 × 1000MM Min Board Thickness 2 Layer – 0.3MM ( 12 mil ) 4 Layer – 0.4MM ( 16 mil ) 6 Layer – 0.8MM ( 32 mil ) 8 Layer – 1.0MM ( 40 mil) 10 Layer – 1.1MM ( 44 mil ) 12 Layer – 1.3MM ( 52 mil ) 14 Layer – 1.5MM ( 59 mil ) 16 Layer – 1.6MM ( 63 mil ) 18 Layer – 1.8MM ( 71 mil ) Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% Twisting and Bending ≤ 0.75%, Min: 0.5% Range of TG 130 – 215 ℃ Impedance Tolerance ± 10%, Min: ± 5% Hi-Pot Test Max: 4000V/10MA/60S Surface Treatment HASL, With Lead, HASL Free Lead Flash Gold, Immersion Gold Immersion Silver, Immersion Tin Gold Finger, OSP PCB Cu Thickness + Plating Out Layer Cu Thickness 1 – 6OZ Inner Layer Cu Thickness 0.5 – 4OZ Cu Thickness of PTH 20UM ≤ Average ≤ 25UM Min: 18UM HASL with Lead Tin 63% Lead 37% HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM Thick Gold Plating Ni Thickness: 3 – 5UM ( 120u” – 200u” ) Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” ) Immersion Gold Ni Thckness: 3 – 5UM ( 120u” – 200u” ) Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” ) Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” ) Gold Finger Ni Thickness: 3 – 5UM ( 120u” – 160u” ) Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” ) U940 PCB Pattern Limit Capability Min Width 0.075MM ( 3 mil ) Min Trace 0.075MM ( 3 mil ) Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil ) Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil ) Min Solder Bridge 0.1MM ( 4 mil ) Min Height of Legend 0.7MM ( 28 mil ) Min Width of Legend 0.15MM ( 6 mil ) PCB Holes Processing Capability Final Hole Size Min: Laser 0.1MM, Machine 0.2MM Drilling Hole Size 0.10 – 6.5MM Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM Final Hole Size Tolerance ( PTH ) φ0.20 – 1.60MM ± 0.075MM φ1.60 – 6.30MM ± 0.10MM Final Hole Size Tolerance ( NPTH ) φ0.20 – 1.60MM ± 0.05MM φ1.60 – 6.50MM ± 0.05MM Drilling Strip Hole -0L ~tu.’gth /width 2:1 Min Strip Hole Width 0.65MM Length & Width Tolerance ± 0.05MM Board Thickness / Hole Size ≤ 10:1 PCB Cover Thickness Capability Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White Solder Mask Thickness Surface Line ≥ 10UM Surface Line Corner ≥ 6UM Surface Board 10 – 25UM Solder Mask Bridge Width Legend Color White,Yellow,Black Min Height of Legend 0.70MM ( 28 mil ) Min Width of Legend 0.15MM ( 6 mil ) Blue Gel Thickness 0.2 – 1.5MM Blue Gel Tolerance ±0.15MM Carbon Print Thickness 5 – 25UM Carbon Print Min Space 0.25MM Carbon Print Impedance 200Ω Blind/Burried/Half Via PCB Capability Parameters (1+1)e.g.(4-layer)blind via:1-2,2-4(6-layer)buried via:2-3,3-4 (8-layer)blind/buried:1-3,4-5,6-8 Min Via Laser 0.1MM, Machine 0.2MM Half Via Min: 0.6MM Impedance Capability Resistance Value Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω PCBA Capability Our PCBA Capability SMT, PTH, mixed technology SMT: 2,000,000 solder joints per day DIP: 300,000 joints per day Ultra fine pitch, QFP, BGA, μBGA, CBGA Advanced SMT assembly Automated insertion of PTH (axial, radial, dip) Cleanable, aqueous and lead-free processing RF manufacturing expertise Peripheral process capabilities Pressfit back planes & mid planes Device programming Automated conformal coating For E-Test Universal Tester Flying Probe Open/Short Tester High power Microscope Solder ability Testing Kit Peel Strength tester High Volt Open & Short tester Cross Section Molding Kit With Polisher If you need PCB assembly service as well, could you give us following information? 1. Gerber file of the bare PCB board 2. BOM(Bill of material) for assembly To short the Lead time, please kindly advise us if there is any acceptable components substitution. 3. Testing Guide & Test Fixtures, if necessary 4. Programming files & Programming tool, is necessary 5. Schematic, if necessary Our Production Capability for PCB Number of Layer 1 – 20 Layer Maximum Processing Area 680 × 1000MM Min Board Thickness 2 Layer – 0.3MM ( 12 mil ) 4 Layer – 0.4MM ( 16 mil ) 6 Layer – 0.8MM ( 32 mil ) 8 Layer – 1.0MM ( 40 mil) 10 Layer – 1.1MM ( 44 mil ) 12 Layer – 1.3MM ( 52 mil ) 14 Layer – 1.5MM ( 59 mil ) 16 Layer – 1.6MM ( 63 mil ) 18 Layer – 1.8MM ( 71 mil ) Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% Twisting and Bending ≤ 0.75%, Min: 0.5% Range of TG 130 – 215 ℃ Impedance Tolerance ± 10%, Min: ± 5% Hi-Pot Test Max: 4000V/10MA/60S Surface Treatment HASL, With Lead, HASL Free Lead Flash Gold, Immersion Gold Immersion Silver, Immersion Tin Gold Finger, OSP We provide OEM services to all sorts of printed circuit board assembly as well as electronic encased products. Multilayer PCB Promotion In June – 12% discount for multilayer PCBs – more surprises for regular customers Deadline: July 5th,2015 Advantages – No MOQ – OEM services provided – Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable – Factory direct price – Replying with price in one working day – Shipping within 24 hours – Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free PCB Capacity PCB General Capability Number of Layer 1 – 20 Layer Maximum Processing Area 680 × 1000MM Min Board Thickness 2 Layer – 0.3MM ( 12 mil ) 4 Layer – 0.4MM ( 16 mil ) 6 Layer – 0.8MM ( 32 mil ) 8 Layer – 1.0MM ( 40 mil) 10 Layer – 1.1MM ( 44 mil ) 12 Layer – 1.3MM ( 52 mil ) 14 Layer – 1.5MM ( 59 mil ) 16 Layer – 1.6MM ( 63 mil ) 18 Layer – 1.8MM ( 71 mil ) Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% Twisting and Bending ≤ 0.75%, Min: 0.5% Range of TG 130 – 215 ℃ Impedance Tolerance ± 10%, Min: ± 5% Hi-Pot Test Max: 4000V/10MA/60S Surface Treatment HASL, With Lead, HASL Free Lead Flash Gold, Immersion Gold Immersion Silver, Immersion Tin Gold Finger, OSP PCB Cu Thickness + Plating Out Layer Cu Thickness 1 – 6OZ Inner Layer Cu Thickness 0.5 – 4OZ Cu Thickness of PTH 20UM ≤ Average ≤ 25UM Min: 18UM HASL with Lead Tin 63% Lead 37% HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM Thick Gold Plating Ni Thickness: 3 – 5UM ( 120u” – 200u” ) Gold Thickness: 0.025 – 1.27UM ( 1u” – 50u” ) Immersion Gold Ni Thckness: 3 – 5UM ( 120u” – 200u” ) Gold Thickness: 0.025 – 0.15UM ( 1u” – 3u” ) Immersion Silver Ag Thickness: 0.15- 0.75 UM ( 6u” – 30u” ) Gold Finger Ni Thickness: 3 – 5UM ( 120u” – 160u” ) Gold Thickness: 0.025 – 1.51UM ( 1u” – 60u” ) U940 PCB Pattern Limit Capability Min Width 0.075MM ( 3 mil ) Min Trace 0.075MM ( 3 mil ) Min Width of Ring ( Inner Layer ) 0.15MM ( 6 mil ) Min Width of Ring ( Out Layer ) 0.1MM ( 4 mil ) Min Solder Bridge 0.1MM ( 4 mil ) Min Height of Legend 0.7MM ( 28 mil ) Min Width of Legend 0.15MM ( 6 mil ) PCB Holes Processing Capability Final Hole Size Min: Laser 0.1MM, Machine 0.2MM Drilling Hole Size 0.10 – 6.5MM Drilling Tolerance NPTH: ±0.05MM, PTH: ±0.075MM Final Hole Size Tolerance ( PTH ) φ0.20 – 1.60MM ± 0.075MM φ1.60 – 6.30MM ± 0.10MM Final Hole Size Tolerance ( NPTH ) φ0.20 – 1.60MM ± 0.05MM φ1.60 – 6.50MM ± 0.05MM Drilling Strip Hole -0L ~tu.’gth /width 2:1 Min Strip Hole Width 0.65MM Length & Width Tolerance ± 0.05MM Board Thickness / Hole Size ≤ 10:1 PCB Cover Thickness Capability Solder Mask Color Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White Solder Mask Thickness Surface Line ≥ 10UM Surface Line Corner ≥ 6UM Surface Board 10 – 25UM Solder Mask Bridge Width Legend Color White,Yellow,Black Min Height of Legend 0.70MM ( 28 mil ) Min Width of Legend 0.15MM ( 6 mil ) Blue Gel Thickness 0.2 – 1.5MM Blue Gel Tolerance ±0.15MM Carbon Print Thickness 5 – 25UM Carbon Print Min Space 0.25MM Carbon Print Impedance 200Ω Blind/Burried/Half Via PCB Capability Parameters (1+1)e.g.(4-layer)blind via:1-2,2-4(6-layer)buried via:2-3,3-4 (8-layer)blind/buried:1-3,4-5,6-8 Min Via Laser 0.1MM, Machine 0.2MM Half Via Min: 0.6MM Impedance Capability Resistance Value Single-ended 50 – 75Ω, Difference 100Ω, Coplanar 50 – 75Ω PCBA Capability Our PCBA Capability SMT, PTH, mixed technology SMT: 2,000,000 solder joints per day DIP: 300,000 joints per day Ultra fine pitch, QFP, BGA, μBGA, CBGA Advanced SMT assembly Automated insertion of PTH (axial, radial, dip) Cleanable, aqueous and lead-free processing RF manufacturing expertise Peripheral process capabilities Pressfit back planes & mid planes Device programming Automated conformal coating For E-Test Universal Tester Flying Probe Open/Short Tester High power Microscope Solder ability Testing Kit Peel Strength tester High Volt Open & Short tester Cross Section Molding Kit With Polisher If you need PCB assembly service as well, could you give us following information? 1. Gerber file of the bare PCB board 2. BOM(Bill of material) for assembly To short the Lead time, please kindly advise us if there is any acceptable components substitution. 3. Testing Guide & Test Fixtures, if necessary 4. Programming files & Programming tool, is necessary 5. Schematic, if necessary Our Production Capability for PCB Number of Layer 1 – 20 Layer Maximum Processing Area 680 × 1000MM Min Board Thickness 2 Layer – 0.3MM ( 12 mil ) 4 Layer – 0.4MM ( 16 mil ) 6 Layer – 0.8MM ( 32 mil ) 8 Layer – 1.0MM ( 40 mil) 10 Layer – 1.1MM ( 44 mil ) 12 Layer – 1.3MM ( 52 mil ) 14 Layer – 1.5MM ( 59 mil ) 16 Layer – 1.6MM ( 63 mil ) 18 Layer – 1.8MM ( 71 mil ) Finished Board Thickness Tolerance Thickness ≤ 1.0MM, Tolerance: ± 0.1MM 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% Twisting and Bending ≤ 0.75%, Min: 0.5% Range of TG 130 – 215 ℃ Impedance Tolerance ± 10%, Min: ± 5% Hi-Pot Test Max: 4000V/10MA/60S Surface Treatment HASL, With Lead, HASL Free Lead Flash Gold, Immersion Gold Immersion Silver, Immersion Tin Gold Finger, OSP We provide OEM services to all sorts of printed circuit board assembly as well as electronic encased products.